The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Apr. 23, 2021
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 23/522 (2013.01); H01L 23/5286 (2013.01); H01L 27/0207 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method includes forming signal lines in a pair of neighboring metal layers of a semiconductor device, and forming first dummy conductive cells in an empty area without metal lines passing therethrough, between the pair of neighboring metal layers. At least two dummy conductive cells of the first dummy conductive cells that are separated from each other, and the at least two dummy conductive cells fully overlap one of the signal lines in plan view.