The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Jul. 22, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chung-Hui Chen, Hsinchu, TW;

Hao-Chieh Chan, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); G06F 30/39 (2020.01); H01L 21/8238 (2006.01); H01L 23/50 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); G06F 30/39 (2020.01); H01L 21/823892 (2013.01); H01L 23/5226 (2013.01); H01L 23/5286 (2013.01);
Abstract

A method of forming a semiconductor device. The method includes forming a first well of a first-type in a substrate of a second-type, forming a first active zone of the first-type in a second well of the second-type on the substrate, and forming a second active zone of the second-type in the first-type well. The method also includes forming a first pick-up region of the first-type located in the first well, and forming a second pick-up region of the second-type located in the second well. Each of the first active zone and the second active zone extends in a first direction. The first pick-up region and the second pick-up region are separated from each other, by the first active zone and the second active zone, along a direction that is different from the first direction.


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