The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Nov. 30, 2020
Applicant:
Ibiden Co., Ltd., Gifu, JP;
Inventor:
Satoru Kawai, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/25 (2006.01); H01F 41/04 (2006.01); H01F 41/24 (2006.01); H01L 21/48 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01F 27/255 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H01F 41/24 (2013.01); H01L 21/486 (2013.01); H01L 21/4864 (2013.01); H01L 23/49827 (2013.01); H01L 23/645 (2013.01); H01F 27/255 (2013.01); H01F 2027/2809 (2013.01);
Abstract
An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes of the core substrate and including metal films formed in the first through holes of the core substrate, respectively, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin such that the metal films are filling the second through holes of the magnetic resin, respectively.