The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Dec. 23, 2020
Intel Corporation, Santa Clara, CA (US);
Arvind S, Bangalore, IN;
Raghavendra Rao, Bangalore, IN;
Geejagaaru Krishnamurthy Sandesh, Bangalore, IN;
Intel Corporation, Santa Clara, CA (US);
Abstract
A printed circuit board (PCB), comprising a first layer, the first layer comprising a first dielectric material substantially exclusively. The PCB also comprises a second layer, the second layer comprising the first dielectric material within a first region and a second dielectric material within a second region adjacent to first region. The first dielectric material has a first dielectric constant, a first coefficient of thermal expansion (CTE) and a first glass transition temperature (Tg). The second dielectric material has a second dielectric constant, a second CTE and a second Tg. The first dielectric constant is greater than the second dielectric constant. The first CTE is substantially equal to the second CTE; and the first Tg and the second Tg are greater than 150° C.