The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Jun. 10, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Khaled Ahmed, San Jose, CA (US);

Thomas L. Sounart, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); B24B 7/22 (2006.01); C09K 13/04 (2006.01); C09K 13/06 (2006.01); C09K 13/08 (2006.01); H01L 25/075 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); B24B 7/228 (2013.01); C09K 13/04 (2013.01); C09K 13/06 (2013.01); C09K 13/08 (2013.01); H01L 25/0753 (2013.01); H01L 27/1214 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An semiconductor manufacturing apparatus and method to smooth surfaces of discrete pads on a substrate. The method includes placing a surface of one of the discrete pads in registration with a first chamber of a set of chambers of a smoothing tool, the set corresponding to a smoothing cycle of the smoothing tool; etching, within the first chamber, a surface of one of the discrete pads to form an etch layer on the surface; placing the surface in registration with a second chamber of the set; after the etch, pumping gas and vapor from the surface within the second chamber; placing the surface in registration with a third chamber of the set; and applying heating to the surface in the third chamber to smooth the surface.


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