The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Jan. 26, 2022
Applicant:
Changxin Memory Technologies, Inc., Anhui, CN;
Inventor:
Ping-Heng Wu, Anhui, CN;
Assignee:
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/481 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/481 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06541 (2013.01);
Abstract
A semiconductor structure includes: a base; a conductive column, which is at least located in the base; an electric connection layer, which is connected to an end part of the conductive column. The end part, towards the electric connection layer, of the conductive column has a first protruding part and at least one groove defined by the first protruding part, the electric connection layer has a second protruding part at a position corresponding to the groove, and the second protruding part is embedded in the groove.