The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
May. 27, 2021
Applicant:
Sumitomo Osaka Cement Co., Ltd., Tokyo, JP;
Inventors:
Masaki Hirayama, Tokyo, JP;
Tetsuro Itagaki, Tokyo, JP;
Assignee:
SUMITOMO OSAKA CEMENT CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/32082 (2013.01); H01J 37/32568 (2013.01); H01J 37/32577 (2013.01); H01L 21/6833 (2013.01); H01J 37/32541 (2013.01); H01J 2237/2007 (2013.01);
Abstract
A wafer support device includes a dielectric substrate and an RF electrode provided in the dielectric substrate. The RF electrode is divided into a plurality of zone electrodes arranged in a planar direction of the dielectric substrate. The wafer support device has: a short-circuit member interconnecting the plurality of zone electrodes; and a main power supply rod connected to the short-circuit member from a back side of the dielectric substrate.