The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Sep. 12, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Yung-Shun Chen, Hsinchu, TW;
Chih-Chiang Chang, Taipei, TW;
Chung-Peng Hsieh, New Taipei, TW;
Yung-Chow Peng, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/317 (2006.01); G01R 27/26 (2006.01); G01R 31/10 (2006.01); H03B 27/00 (2006.01); H03L 7/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/31727 (2013.01); G01R 27/2605 (2013.01); G01R 27/2617 (2013.01); G01R 31/10 (2013.01); H03B 27/00 (2013.01); H03L 7/00 (2013.01);
Abstract
A device for measuring characteristics of a wafer is provided. The device includes a first circuit on the wafer and having a first number of parallelly connected oscillators, and a second circuit on the wafer and having the first number of parallelly connected oscillators; wherein a first portion of the second circuit is disconnected from a second portion of the second circuit.