The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Mar. 27, 2019
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Hideyuki Katagi, Tokyo, JP;
Yuki Nakamura, Tokyo, JP;
Kazumasa Fukuda, Tokyo, JP;
Tomohiro Ikeda, Tokyo, JP;
Lin Tian, Tokyo, JP;
Kei Tougasaki, Tokyo, JP;
Naoki Maruyama, Tokyo, JP;
Yoshitaka Takezawa, Tokyo, JP;
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/14 (2006.01); C08G 59/16 (2006.01); C08G 59/24 (2006.01); C08G 59/28 (2006.01); C08G 59/30 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08G 59/1455 (2013.01); C08G 59/245 (2013.01); C08G 59/4064 (2013.01); C08G 59/5033 (2013.01); C08G 59/688 (2013.01);
Abstract
An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.