The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Nov. 24, 2021
Changxin Memory Technologies, Inc., Hefei, CN;
Jingwen Lu, Hefei, CN;
Hai-Han Hung, Hefei, CN;
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Abstract
The embodiments of the present disclosure belong to the field of semiconductor manufacturing technology and relates to a method for manufacturing a semiconductor structure and a semiconductor structure. The method for manufacturing the semiconductor structure includes: a bit line structure is formed on a substrate, a fill channel is formed between the insulating structures on two adjacent bit lines; a conductor is formed within the fill channel; at least one slit is formed on the conductor along a direction perpendicular to a longitudinal direction of each of the plurality of bit line to divide the conductor into a plurality of conductive blocks, each of the plurality of conductive blocks is connected to one of transistors on the substrate.