The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Dec. 23, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Penchala Pratap Binni Boyina, Bangalore, IN;

Kathiravan D, Bangalore, IN;

Babu Triplicane Gopikrishnan, Bangalore, IN;

Prakash Kurma Raju, Bangalore, IN;

Deepak Sekar, Bangalore, IN;

Hari Shanker Thakur, Bangalore, IN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/04 (2006.01); G06F 1/20 (2006.01); H01L 23/40 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/04 (2013.01); G06F 1/203 (2013.01); H01L 23/4006 (2013.01); H01L 23/427 (2013.01); H01L 2023/4087 (2013.01);
Abstract

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.


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