The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Mar. 26, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Albert Sutono, Chandler, AZ (US);

Xiaoning Ye, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01); H01P 3/08 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01P 3/08 (2013.01); H01L 23/49838 (2013.01); H01L 23/5283 (2013.01); H01L 23/66 (2013.01); H05K 1/0228 (2013.01); H01L 23/49822 (2013.01); H01L 2223/6627 (2013.01);
Abstract

Electronic structures including a dual-stripline with crosstalk cancellation are described. In an example, a printed circuit board (PCB), a package substrate or a semiconductor die includes a dual-stripline structure. The dual-stripline structure includes a first region including a first top line vertically over a first bottom line, and a second top line vertically over a second bottom line. The dual-stripline structure also includes a second region including the first top line vertically over the second bottom line, and the second top line vertically over the first bottom line. The dual-stripline structure also includes a transition region between the first region and the second region. The first bottom line and the second bottom line cross in the transition region.


Find Patent Forward Citations

Loading…