The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Jul. 14, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Zhengbo Wang, Shanghai, CN;

Jia Sun, Shanghai, CN;

Ming Ma, Shanghai, CN;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01); G06F 12/06 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0659 (2013.01); G06F 3/0604 (2013.01); G06F 3/0679 (2013.01); G06F 12/063 (2013.01); G06F 2212/7201 (2013.01);
Abstract

Methods, systems, and devices for techniques for firmware enhancement in memory devices are described. A memory system may include a volatile memory device and a non-volatile memory device, which may store a node address mapping. A host system in communication with the memory system may transmit a command instructing the memory system to transfer at least a portion of the node address mapping from the non-volatile memory device to the volatile memory device. The memory system may transmit a response to the command to the host system indicating a status associated with transferring the portion of the node address mapping.


Find Patent Forward Citations

Wang, Zhengbo. (2024). Techniques for firmware enhancement in memory devices (U.S. Patent No. 12112066). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12112066

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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