The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Aug. 10, 2020
Applicant:
Xcerra Corporation, Norwood, MA (US);
Inventors:
Yukang Feng, St. Paul, MN (US);
Jason Mroczkowski, St. Paul, MN (US);
Marty Cavegn, St. Paul, MN (US);
Assignee:
Xcerra Corporation, Norwood, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/00 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01R 3/00 (2013.01); G01R 1/06772 (2013.01); G01R 1/07307 (2013.01); G01R 1/07342 (2013.01); G01R 31/2889 (2013.01); H01L 22/14 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/3011 (2013.01);
Abstract
An apparatus and method for the manufacturing and use in a semiconductor test system is disclosed. The apparatus includes a signal probe and a dielectric sleeve surrounding the signal probe. A method includes forming a mold to receive a component of a contactor assembly, inserting the component into the mold, and forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process. The component includes one or more signal probe holes.