The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Jan. 29, 2021
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Hung-Hsien Huang, Kaohsiung, TW;
Shin-Luh Tarng, Kaohsiung, TW;
Ian Hu, Kaohsiung, TW;
Chien-Neng Liao, Hsinchu, TW;
Jui-Cheng Yu, Hsinchu, TW;
Po-Cheng Huang, Tainan, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28D 15/02 (2006.01); F28F 13/18 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01); F28D 15/0233 (2013.01); F28D 15/0283 (2013.01); F28F 13/187 (2013.01); F28F 2255/18 (2013.01);
Abstract
A heat transfer element, a method for manufacturing the same and a semiconductor structure including the same are provided. The heat transfer element includes a housing, a chamber, a dendritic layer and a working fluid. The chamber is defined by the housing. The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber.