The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Sep. 24, 2021
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Akihiro Hakamata, Haibara-gun, JP;

Naoya Shimoju, Haibara-gun, JP;

Yuichiro Goto, Haibara-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); C08F 2/50 (2006.01); C08F 220/10 (2006.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
B29C 59/02 (2013.01); C08F 2/50 (2013.01); C08F 220/10 (2013.01); G03F 7/0002 (2013.01); G03F 7/0045 (2013.01); G03F 7/0046 (2013.01); G03F 7/2004 (2013.01); G03F 7/2018 (2013.01);
Abstract

A composition for forming an underlayer film in an imprinting method, which includes a high-molecular-weight compound having a polymerizable functional group and a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group, and in which a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.0 or less, and regarding the two crosslinking functional groups among the plurality of crosslinking functional groups, the number of atoms, which constitute a shortest atom chain mutually linking crosslinking points in the respective crosslinking functional groups, is 7 or more; a laminate including a layer formed of the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, in which a semiconductor element is manufactured using a pattern obtained by a pattern producing method.


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