The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Aug. 27, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Yiming Zhu, Hefei, CN;

Erxuan Ping, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H10B 12/312 (2023.02); H01L 29/0649 (2013.01); H10B 12/482 (2023.02);
Abstract

A method for forming a semiconductor structure includes: providing a substrate, where a sacrificial layer and an active layer located on the sacrificial layer are formed on the substrate; patterning the active layer and the sacrificial layer to form a groove, where the active layer and the sacrificial layer are divided into a plurality of active regions by the groove; forming a first isolation layer surrounding the active regions in the groove; patterning the active layer in the active regions to form a plurality of separate active patterns, where at least one of side walls or ends of the active patterns is connected to the first isolation layer; removing the sacrificial layer along an opening located between two adjacent one of the active patterns to form a gap between a bottom of the active patterns and the semiconductor substrate; and forming a bit line in the gap.


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