The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Dec. 28, 2021
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Ati Technologies Ulc, Markham, CA;
Wonjun Jung, Markham, CA;
Jasmeet Singh Narang, Markham, CA;
Tyrone Huang, Markham, CA;
Christopher Klement, Markham, CA;
Alan D. Smith, Santa Clara, CA (US);
Edward Chang, Santa Clara, CA (US);
John Wuu, Santa Clara, CA (US);
Advanced Micro Devices, Inc., Santa Clara, CA (US);
ATI Technologies ULC, Markham, CA;
Abstract
Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.