The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Mar. 09, 2021
Applicant:

Zing Semiconductor Corporation, Shanghai, CN;

Inventors:

Lanlin Wen, Shanghai, CN;

Tian Feng, Shanghai, CN;

Zhen Zhou, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/225 (2006.01); H01J 49/00 (2006.01); H01J 49/10 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/10 (2013.01); H01J 49/0031 (2013.01); H01J 49/105 (2013.01); H01L 21/2252 (2013.01); H01L 22/12 (2013.01);
Abstract

The present application provides a detection method of metal impurity in wafer. The method comprises conducting a medium temperature thermal treatment for a first predicted time period to the wafer, cooling the wafer and conducting a low temperature thermal treatment for a second predicted time period, cooling the wafer to ambient temperature; providing a liquid of vapor phase decomposition on the wafer to collect metal impurities; atomizing the liquid containing the collected metal impurities, conducting an inductively coupled plasma mass spectrometry analysis and obtaining concentrations of the metal impurities. The present application applies the combination of various thermal treatment without an interrupt of cooling to ambient temperature to contemplate diffusions of various metal impurities to the wafer surface. Accordingly, the detection of metal impurities can be conducted with reduced time cost and enhanced efficiency.


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