The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Oct. 21, 2021
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Kazuya Hirata, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); B23K 26/38 (2014.01); B23K 26/53 (2014.01); B23K 101/40 (2006.01); H01L 21/04 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3043 (2013.01); B23K 26/38 (2013.01); B23K 26/53 (2015.10); H01L 21/0445 (2013.01); H01L 21/67092 (2013.01); B23K 2101/40 (2018.08);
Abstract
A peeling layer is formed by applying a laser beam only to a central region of a workpiece other than a peripheral region extending inward from the peripheral edge of the workpiece by a predetermined distance. In this case, the application of the laser beam does not form the peeling layer in the peripheral region of the workpiece, and the formation of an ablation trace on the outer peripheral surface of the workpiece is prevented. As a result, it is possible to reduce a probability of occurrence of chipping in the peripheral region of a wafer peeled off from the workpiece when the wafer is subjected to a post-process.