The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Mar. 02, 2023
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Junichi Nakamura, Nagano, JP;
Takeshi Takai, Nagano, JP;
Yusuke Karasawa, Nagano, JP;
Yoshihisa Kanbe, Nagano, JP;
Shuhei Momose, Nagano, JP;
Toshiki Shirotori, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4661 (2013.01); H05K 1/115 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/096 (2013.01);
Abstract
A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.