The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

May. 17, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chung-Chieh Yang, Hsinchu, TW;

Ching-Ting Lu, Hsinchu, TW;

Yung-Chow Peng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/32135 (2013.01); H01L 21/32139 (2013.01); H01L 21/76892 (2013.01); H01L 23/5223 (2013.01);
Abstract

An integrated circuit includes an array of metal conducting lines in a metal layer overlying an insulation layer supported by a substrate, a first metal segment lineup having multiple metal segments in the metal layer between a first metal conducting line and a second metal conducting line in the array of metal conducting lines, and an electric circuit having a first input and a second input. The first input is connected to the first metal conducting line and the second input is connected to the second metal conducting line, and a first length of the first metal conducting line is equal to a second length of the second metal conducting line.


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