The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Sep. 14, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Beomseok Choi, Chandler, AZ (US);
Adel A. Elsherbini, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2876 (2013.01); H01F 27/10 (2013.01);
Abstract
An electronic package comprises, a package substrate, and a magnetic block, where the magnetic block passes through the package substrate. the electronic package further comprises a fluidic path from an inlet to the package substrate to an outlet of the package substrate. The electronic package further comprises a conductive winding in the package substrate, where the conductive winding wraps around the magnetic block, and where the conductive winding is tubular and the fluidic path passes through the conductive winding.