The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Oct. 11, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Tyler Leuten, Orangevale, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0097 (2013.01); H05K 1/117 (2013.01); H05K 1/181 (2013.01); H05K 3/0026 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/09972 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/308 (2013.01);
Abstract
Embodiments disclosed herein include a printed circuit board (PCB) with a non-uniform thickness and methods of fabricating such PCBs. In an embodiment, the PCB comprises a connector region with a top surface and a bottom surface, and a component region with a top surface and a bottom surface. In an embodiment, the bottom surface of the connector region is coplanar with the bottom surface of the component region. In an embodiment the top surface of the connector region is not coplanar with the top surface of the component region.