The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Aug. 24, 2021
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Shigeki Sato, Matsumoto, JP;

Toshiyuki Matsui, Matsumoto, JP;

Ryu Araki, Matsumoto, JP;

Hiroshi Miyata, Matsumoto, JP;

Soichi Yoshida, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); G01R 31/26 (2020.01); H01L 27/02 (2006.01); H01L 29/06 (2006.01); H01L 29/866 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7396 (2013.01); G01R 31/2619 (2013.01); H01L 27/0255 (2013.01); H01L 29/0607 (2013.01); H01L 29/0623 (2013.01); H01L 29/0696 (2013.01); H01L 29/866 (2013.01);
Abstract

A semiconductor device including: a semiconductor substrate; a temperature sensing unit provided on a front surface of the semiconductor substrate; an anode pad and a cathode pad electrically connected with the temperature sensing unit; a front surface electrode being set to a predetermined reference potential; and a bidirectional diode unit electrically connected in a serial bidirectional way between the cathode pad and the front surface electrode is provided. The output comparison diode unit may be arranged between the anode pad and the cathode pad. The temperature sensing unit may include a temperature sensing diode, and the output comparison diode unit may include a diode connected in inverse parallel to the temperature sensing diode.


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