The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Dec. 24, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Hwa Chaw Law, Kuala Langat, MY;

Yu Ying Ong, Bayan Lepas, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 29/42 (2006.01); G11C 29/00 (2006.01); G11C 29/12 (2006.01); G11C 29/44 (2006.01);
U.S. Cl.
CPC ...
G11C 29/42 (2013.01); G11C 29/1201 (2013.01); G11C 29/44 (2013.01); G11C 29/78 (2013.01);
Abstract

A modular Error Correction Code (ECC) scheme in a multi-channel IO link of an integrated circuit device is provided. The integrated circuit device may include core logic circuitry that may be configured after manufacturing. To accommodate the resulting variation, the modular ECC scheme may allow for partitioning a parity check matrix associated with the configuration of the core logic and peripheries coupled to the core logic. The parity check matrix is partitioned into smaller block matrices that is programmable. Multiple ECC modules corresponding to the block matrices are used to provide error detection and correction in the multi-channel IO link. The modular ECC scheme combined with programmable matrices (configurability) enables multi-channel IO link to be flexible to form different IO topologies.


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