The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Apr. 01, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rob W. Sims, Forest Grove, OR (US);

Aurelio Rodriguez Echevarria, Zapopan, MX;

Jorge P. Rodriguez, Portland, OR (US);

Phil R. Lehwalder, Hillsboro, OR (US);

Sivasankarareddy Juturu, Bangalore, IN;

Stephen P. Eastman, Rocklin, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/20 (2006.01); G06F 1/26 (2006.01); G06F 1/28 (2006.01);
U.S. Cl.
CPC ...
G06F 13/20 (2013.01); G06F 2213/40 (2013.01);
Abstract

A power supply comprising a hardware interface having conductive contacts and conforming to a power supply design standard comprising a pin-out definition specifying that a first conductive contact is to be dedicated to communicating first information of a first type. The power supply comprises first, second, and third circuitry. The first circuitry is to determine the first information. The second circuitry is to determine second information of a second type, wherein the second type of information is other than the first type. The third circuitry is to send, via the first conductive contact, a communication comprising the first information and the second information. In embodiments, a PCB comprises a connector to couple the PCB to the power supply via an interconnect to be coupled to the hardware interface, and an IC to receive the communication, and identify the first and second information.


Find Patent Forward Citations

Loading…