The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Aug. 27, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-En Huang, Xinfeng, TW;

Meng-Han Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 51/50 (2023.01); H01L 23/522 (2006.01); H10B 51/20 (2023.01); H10B 51/30 (2023.01);
U.S. Cl.
CPC ...
H10B 51/50 (2023.02); H01L 23/5226 (2013.01); H10B 51/20 (2023.02); H10B 51/30 (2023.02);
Abstract

Memory devices and a method of fabricating memory devices are disclosed. In one aspect, the method includes forming a plurality of first transistors in a first area and a plurality of second transistors in a second area and forming a stack over the second area. The method includes forming a memory array portion and an interface portion through the stack. The memory array portion includes memory strings and the interface portion includes first conductive structures extending along a lateral direction. The method further includes simultaneously forming second conductive structures in the first area and forming third conductive structures in the second area. The second conductive structures each vertically extend to electrically couple to at least one of the first transistors, and the third conductive structures each vertically extend through one of the memory strings to electrically couple to at least one of the second transistors.


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