The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Jul. 13, 2020
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Hideto Tamaso, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 29/66068 (2013.01); H01L 29/78684 (2013.01);
Abstract

A method for manufacturing a silicon carbide semiconductor device, includes the steps of depositing an insulating film on a principal surface of a silicon carbide substrate, forming a contact hole in the insulating film and exposing the principal surface, forming a Si film on bottom and a side surfaces of the contact hole, and a top surface of the insulating film, removing the Si film on the bottom surface of the contact hole and exposing the principal surface, depositing a Ni film on the bottom surface of the contact hole and the Si film, and performing a heat treatment to form a first alloy layer, which becomes an ohmic electrode, at the bottom surface of the contact hole by Si included in the substrate and the Ni film, and a second alloy layer at the top surface of the insulating film by the Si film and the Ni film.


Find Patent Forward Citations

Loading…