The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Sep. 09, 2021
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Tatsuya Nishiwaki, Komatsu, JP;
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo, JP;
Abstract
A semiconductor device includes semiconductor elements, an insulating member, first and second terminals and control terminals. The semiconductor elements each include a semiconductor part, a first electrode on the back surface of the semiconductor part, a second electrode and a control electrode on the front surface thereof. The semiconductor elements are electrically connected in series and include first-end and second-end semiconductor elements each provided at an end of the series connection. The insulating member seals the semiconductor elements and includes a first surface and a second surface opposite to the first surface. The first and second terminals are electrically connected to the first electrode of the first-end semiconductor element and the second electrode of the second-end semiconductor element, respectively. Each control terminal is electrically connected to the control electrode. The second and control terminals are provided at one of the first or second surface side of the insulating member.