The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Jan. 05, 2022
Disco Corporation, Tokyo, JP;
Kazuki Hashimoto, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A chip manufacturing method includes a modified layer forming step of forming a modified layer and a crack by applying, along planned dividing lines, a first laser beam having a wavelength transmitted through a substrate of a wafer including the substrate and a laminate in a state in which the back surface side of the substrate is exposed and a condensing point of the first laser beam is positioned within the substrate from the back surface side of the substrate, a grinding step of thinning the wafer to a predetermined thickness by grinding the back surface side of the substrate exposed in the modified layer forming step, and a laser-processed groove forming step of forming a laser-processed groove in the laminate by applying, along the planned dividing lines, a second laser beam having a wavelength absorbed by the substrate, from the front surface side of the wafer.