The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Dec. 30, 2021
Sandisk Technologies Llc, Addison, TX (US);
Rahul Sharangpani, Fremont, CA (US);
Raghuveer S. Makala, Campbell, CA (US);
Fumitaka Amano, Yokkaichi, JP;
SANDISK TECHNOLOGIES LLC, Addison, TX (US);
Abstract
A semiconductor structure includes a first dielectric material layer, a first metal interconnect structure embedded within the first dielectric material layer and including a first metallic material portion including a first metal, a second dielectric material layer located over the first dielectric material layer, and a second metal interconnect structure embedded within the second dielectric material layer and including an integrated line-and-via structure that includes a second metallic material portion including a second metal. A metal-semiconductor alloy portion including a first metal-semiconductor alloy of the first metal and a semiconductor material is located underneath the second metallic material portion, and contacts a top surface of the first metal interconnect structure.