The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Jan. 25, 2024
Applicant:
Yield Engineering Systems, Inc., Fremont, CA (US);
Inventors:
Ramakanth Alapati, Dallas, TX (US);
M Ziaul Karim, San Jose, CA (US);
Christopher Lane, Los Gatos, CA (US);
Assignee:
YIELD ENGINEERING SYSTEMS, INC., Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76831 (2013.01); H01L 21/76822 (2013.01); H01L 23/49894 (2013.01); H01L 23/5329 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01);
Abstract
A method of improving interfacial adhesion of a copper-glass interface in a Through Glass Via (TGV) of an electronic device includes coating an internal wall of a TGV with a curable polymer material having a viscosity less than 30 Poise. The coating is cured to form a dielectric liner having a tensile strength greater than about 8 Mpa and a dielectric loss less than about 0.002. A layer of copper may then be deposited on the dielectric liner.