The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Jul. 13, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kuo-Shu Tseng, New Taipei, TW;

Yao-Yuan Shang, Taichung, TW;

You-Feng Chen, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 1/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); H01L 21/67046 (2013.01); B08B 1/00 (2013.01); H01L 21/0209 (2013.01);
Abstract

A wafer cleaning method for cleaning contaminants on a wafer is provided, wherein the backside of the wafer has a clear area and an unclear area, and the contaminants are located in the unclear area. The wafer cleaning method includes inspecting the backside of the wafer and generating an inspection signal by an inspection device. The wafer cleaning method includes generating a control signal according to the inspection signal by a process module, wherein the control signal includes movement information of a brush element according to coordinates of the contaminants obtained from the inspection signal. The wafer cleaning method includes controlling the brush element to clean the contaminants on the backside of the wafer according to the control signal by a control device along a predetermined path.


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