The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2024

Filed:

Sep. 03, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hirotoshi Mori, Koshi, JP;

Yoshihiro Kawaguchi, Koshi, JP;

Kazuya Hisano, Koshi, JP;

Hayato Tanoue, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); B23K 26/53 (2014.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); B23K 26/53 (2015.10); H01L 21/30604 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01); H01L 21/681 (2013.01); H01L 21/68764 (2013.01);
Abstract

A substrate processing apparatus includes a holder configured to hold a combined substrate in which a first substrate and a second substrate are bonded to each other; a first detector configured to detect an outer end portion of the first substrate; a second detector configured to detect a boundary between a bonding region where the first substrate and the second substrate are bonded and a non-bonding region located at an outside of the bonding region; a periphery removing device configured to remove a peripheral portion of the first substrate as a removing target from the combined substrate held by the holder.


Find Patent Forward Citations

Loading…