The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Dec. 22, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Aleksander Magi, Portland, OR (US);
Jeff Ku, Taipei, TW;
Juha Paavola, Hillsboro, OR (US);
Prakash Kurma Raju, Bangalore, IN;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F16F 7/12 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20454 (2013.01); F16F 7/128 (2013.01); F16F 2222/025 (2013.01); F16F 2230/0023 (2013.01); F16F 2230/48 (2013.01);
Abstract
Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.