The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Dec. 22, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Juha Paavola, Hillboro, OR (US);

Sami Heinisuo, Portland, OR (US);

Kari Mansukoski, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H05K 7/20163 (2013.01); H05K 7/2039 (2013.01); G06F 1/203 (2013.01);
Abstract

thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.


Find Patent Forward Citations

Loading…