The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Dec. 23, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Meer Nazmus Sakib, Berkeley, CA (US);

Peicheng Liao, Santa Clara, CA (US);

Ranjeet Kumar, San Jose, CA (US);

Duanni Huang, San Jose, CA (US);

Haisheng Rong, Pleasanton, CA (US);

Harel Frish, Albuquerque, NM (US);

John Heck, Berkeley, CA (US);

Chaoxuan Ma, Sunnyvale, CA (US);

Hao Li, Hillsboro, OR (US);

Ganesh Balamurugan, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/61 (2013.01);
U.S. Cl.
CPC ...
H04B 10/6165 (2013.01); H04B 10/612 (2013.01); H04B 10/6164 (2013.01);
Abstract

Embodiments described herein may be related to apparatuses, processes, and techniques related to coherent optical receivers, including coherent receivers with integrated all-silicon waveguide photodetectors and tunable local oscillators implemented within CMOS technology. Embodiments are also directed to tunable silicon hybrid lasers with integrated temperature sensors to control wavelength. Embodiments are also directed to post-process phase correction of optical hybrid and nested I/Q modulators. Embodiments are also directed to demultiplexing photodetectors based on multiple microrings. In embodiments, all components may be implements on a silicon substrate. Other embodiments may be described and/or claimed.


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