The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Sep. 22, 2023
Applicant:

Semiconductor Components Industries, Llc, Scottsdale, AZ (US);

Inventors:

Hao Cui, Santa Clara, CA (US);

Clifford Drowley, Santa Clara, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/808 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0634 (2013.01); H01L 29/66522 (2013.01); H01L 29/66734 (2013.01); H01L 29/66909 (2013.01); H01L 29/66924 (2013.01); H01L 29/7813 (2013.01); H01L 29/8083 (2013.01); H01L 21/02389 (2013.01); H01L 21/02458 (2013.01); H01L 21/02496 (2013.01); H01L 21/02502 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02642 (2013.01); H01L 21/28264 (2013.01); H01L 21/30617 (2013.01);
Abstract

A method for manufacturing a vertical JFET includes providing a III-nitride substrate having a first conductivity type and forming a first III-nitride layer coupled to the III-nitride substrate. The first III-nitride layer is characterized by a first dopant concentration and the first conductivity type. The method also includes forming a plurality of trenches within the first III-nitride layer and epitaxially regrowing a second III-nitride structure in the trenches. The second III-nitride structure is characterized by a second conductivity type. The method further includes forming a plurality of III-nitride fins, each coupled to the first III-nitride layer, wherein the plurality of III-nitride fins are separated by one of a plurality of recess regions, and epitaxially regrowing a III-nitride gate layer in the recess regions. The III-nitride gate layer is coupled to the second III-nitride structure and the III-nitride gate layer is characterized by the second conductivity type.


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