The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Apr. 15, 2022
Applicant:

The Institute of Optics and Electronics, the Chinese Academy of Sciences, Sichuan, CN;

Inventors:

Xiangang Luo, Sichuan, CN;

Chengwei Zhao, Sichuan, CN;

Yanqin Wang, Sichuan, CN;

Changtao Wang, Sichuan, CN;

Zeyu Zhao, Sichuan, CN;

Yunfei Luo, Sichuan, CN;

Mingbo Pu, Sichuan, CN;

Yiyun Zhang, Sichuan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70341 (2013.01); G03F 7/2041 (2013.01);
Abstract

Provided is an near-field lithography immersion system, including: an immersion unit including: a liquid flow channel and a gas flow channel configured to apply gas to confine an immersion liquid provided by the liquid flow channel into an exposure field; at least two interface modules, the interface module includes a gas connector, a liquid connector and a brake connector, the gas connector and the liquid connector are correspondingly connected to the gas flow channel and the liquid flow channel, respectively, the brake connector is configured to control an assembly and a disassembly of the immersion unit, and the interface module is detachably connected to the immersion unit; and a mask loading module including a mask base plate and a mask, the immersion liquid is guided to an edge of the mask from below the mask base plate to form an immersion field between the mask and a substrate.


Find Patent Forward Citations

Loading…