The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Sep. 08, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kazuhito Tsuji, Tokyo, JP;

Shao Hua Chang, Tokyo, JP;

Masashi Shimoyama, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 21/04 (2006.01); C25D 17/00 (2006.01); C25D 17/08 (2006.01); C25D 17/10 (2006.01);
U.S. Cl.
CPC ...
C25D 21/04 (2013.01); C25D 17/002 (2013.01); C25D 17/08 (2013.01); C25D 17/10 (2013.01);
Abstract

A technique that ensures suppressing deterioration of a plating quality of a substrate caused by air bubbles accumulated on a lower surface of a membrane is provided. An air bubble removing method of a plating apparatus is an air bubble removing method for removing air bubble in an anode chamberin a plating apparatusincluding a plating tankand a substrate holder. The air bubble removing method includes: supplying a plating solution Ps from at least one supply portdisposed in an outer peripheral portionof the anode chamber to the anode chamber and causing at least one discharge portdisposed in the outer peripheral portion of the anode chamber so as to face the supply port to suction the supplied plating solution to form a shear flow Sf of the plating solution along a lower surface on the lower surfaceof a membranein the anode chamber.


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