The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Dec. 09, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hirotoshi Mori, Kumamoto, JP;

Hayato Tanoue, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/03 (2006.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); B23K 103/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/03 (2013.01); B23K 26/0604 (2013.01); B23K 26/083 (2013.01); H01L 21/67092 (2013.01); B23K 26/0876 (2013.01); B23K 2103/56 (2018.08);
Abstract

A substrate processing apparatus includes a holder configured to hold a combined substrate; a peripheral modifying device configured to form a peripheral modification layer to an inside of a first substrate along a boundary between a peripheral portion and a central portion; an internal modifying device configured to form an internal modification layer to the inside of the first substrate along a plane direction; a holder moving mechanism configured to move the holder in a horizontal direction. The peripheral modifying device radiates laser light for periphery to the inside of the first substrate while moving the holder to perform eccentricity correction. The internal modifying device radiates laser light for internal surface without performing the eccentricity correction at least at a center portion of the inside of the first substrate.


Find Patent Forward Citations

Loading…