The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2024

Filed:

Jun. 13, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yujia Zhai, Fremont, CA (US);

Lai Zhao, Campbell, CA (US);

Xiangxin Rui, Campbell, CA (US);

Dong-Kil Yim, Pleasanton, CA (US);

Tae Kyung Won, San Jose, CA (US);

Soo Young Choi, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 7/00 (2006.01); B08B 9/00 (2006.01); C23C 16/44 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); H01L 27/12 (2006.01); H01L 29/49 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
B08B 7/0035 (2013.01); B08B 9/00 (2013.01); C23C 16/4405 (2013.01); H01J 37/32082 (2013.01); H01L 27/1255 (2013.01); H01L 29/4908 (2013.01); H01J 2237/335 (2013.01); H01L 21/02181 (2013.01); H01L 21/02189 (2013.01); H01L 21/68742 (2013.01); H01L 28/40 (2013.01);
Abstract

In one implementation, a method for cleaning a processing chamber is provided. The method comprises introducing a reactive species into a processing chamber having a residual high-k dielectric material formed on one or more interior surfaces of the processing chamber. The reactive species is formed from a halogen-containing gas mixture and the one or more interior surfaces include at least one surface having a coating material formed thereon. The method further comprises reacting the residual high-k dielectric material with the reactive species to form a volatile product. The method further comprises removing the volatile product from the processing chamber. The removal rate of the residual high-k dielectric material is greater than a removal rate of the coating material. The high-k dielectric material is selected from zirconium dioxide (ZrO) and hafnium dioxide (HfO). The coating material includes a compound selected from alumina (AlO), yttrium-containing compounds, and combinations thereof.


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