The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Sep. 19, 2022
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Chung-Hao Wang, Hsinchu, TW;

Yu-Chi Wang, Hsinchu, TW;

Yi-Ming Chen, Hsinchu, TW;

Yi-Yang Chiu, Hsinchu, TW;

Chun-Yu Lin, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/38 (2010.01); H01L 33/46 (2010.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01); H01L 33/22 (2013.01); H01L 33/387 (2013.01); H01L 33/46 (2013.01); H01L 33/0093 (2020.05);
Abstract

An optoelectronic semiconductor device includes a substrate, a first type semiconductor structure, a second type semiconductor structure, an active structure and a contact structure. The first type semiconductor structure is located on the substrate and has a first protrusion part with a first thickness and a platform part with a second thickness. The second type semiconductor structure is located on the first type semiconductor structure. The active structure is between the first type semiconductor structure and the second type semiconductor structure. The contact structure is disposed between the first type semiconductor structure and the substrate. The second thickness of the platform part is in a range of 0.01 μm to 1 μm.


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