The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Nov. 19, 2020
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Karthik Shanmugam, Singapore, SG;
Flynn P. Carson, Redwood City, CA (US);
Jun Zhai, Cupertino, CA (US);
Raymundo M. Camenforte, San Jose, CA (US);
Menglu Li, San Jose, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H05K 1/02 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/31 (2013.01); H01L 23/3157 (2013.01); H01L 23/49816 (2013.01); H01L 23/4985 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 24/24 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H05K 1/0278 (2013.01); H01L 23/481 (2013.01); H01L 23/5384 (2013.01); H01L 2224/24137 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/18162 (2013.01);
Abstract
Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.