The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Jul. 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jung-Chan Yang, Hsinchu, TW;
Ting-Wei Chiang, Hsinchu, TW;
Cheng-I Huang, Hsinchu, TW;
Hui-Zhong Zhuang, Hsinchu, TW;
Chi-Yu Lu, Hsinchu, TW;
Stefan Rusu, Sunnyvale, CA (US);
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
An integrated circuit structure includes a first, second and third power rail extending in a first direction, a first, second and third set of conductive structures extending in the second direction, and being located at a second level, and a first, second and third conductive structure extending in the second direction, and being located at a third level. The first conductive structure overlaps a first conductive structure of the corresponding first, second and third set of conductive structures. The second conductive structure overlaps a second conductive structure of the corresponding first, second and third set of conductive structures. The third conductive structure overlaps a third conductive structure of the corresponding first, second and third set of conductive structures.