The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Aug. 26, 2020
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Theodorus Wilhelmus Polet, Geldrop, NL;

Koen Steffens, Veldhoven, NL;

Ronald Van Der Ham, Maarheeze, NL;

Gerben Pieterse, Maarheeze, NL;

Erik Henricus Egidius Catharina Eummelen, Veldhoven, NL;

Francis Fahrni, Eindhoven, NL;

Assignee:

ASML NETHERLANDS B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70341 (2013.01); G03F 7/2041 (2013.01); G03F 7/70733 (2013.01); G03F 7/70991 (2013.01);
Abstract

A fluid handling system for wetting a substrate irradiated by radiation. The fluid handling system include a first device to confine a first liquid to a first space between the first device and the substrate. The first device includes a first liquid supply member to provide the first liquid to the first space and an extraction member to remove liquid. The fluid handling system further includes a second device including a second liquid supply member to provide a second liquid to a second space between the second device and the substrate, wherein there is a gap on the surface of the substrate between the first and second liquids. The fluid handling system is configured to provide the second liquid to the second space without removing any liquid from the second space to form a liquid layer, and is configured to provide the first and second liquids on the substrate simultaneously.


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