The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Mar. 01, 2022
Applicant:

Asmpt Singapore Pte. Ltd., Singapore, SG;

Inventors:

Ka Shing Kwan, Singapore, SG;

Ajit Shriman Gaunekar, Singapore, SG;

Zhi Tao Wang, Singapore, SG;

Assignee:

ASMPT SINGAPORE PTE. LTD., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/04 (2006.01); B22F 3/03 (2006.01); B22F 3/12 (2006.01);
U.S. Cl.
CPC ...
G01L 1/04 (2013.01); B22F 3/03 (2013.01); B22F 3/12 (2013.01); B22F 2203/13 (2013.01);
Abstract

A device for measuring a force applied to a component when the component is being bonded to a component carrier, or when the component is being encapsulated includes a deformable portion and a contacting stem connected to the deformable portion. The deformable portion is configured to incorporate a sensor for detecting a degree of deformation of the deformable portion caused by application of the force in order to measure the force. In use, the contacting stem is positionable to contact the component or the component carrier so that the deformable portion is deformed when the force is applied to the component. One or more such devices may be included in a sintering or encapsulation apparatus for measuring the said force.


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