The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2024

Filed:

Mar. 24, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Narae Han, Suwon-si, KR;

Jeonggyu Song, Seongnam-si, KR;

Yongsung Kim, Suwon-si, KR;

Jooho Lee, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/56 (2006.01); C01F 7/02 (2022.01); C01G 15/00 (2006.01); C01G 25/02 (2006.01); C01G 27/02 (2006.01); C23C 14/08 (2006.01); C23C 14/58 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); H10B 12/00 (2023.01); H10B 53/00 (2023.01);
U.S. Cl.
CPC ...
C23C 16/56 (2013.01); C01F 7/02 (2013.01); C01G 15/00 (2013.01); C01G 25/02 (2013.01); C01G 27/02 (2013.01); C23C 14/08 (2013.01); C23C 14/081 (2013.01); C23C 14/5806 (2013.01); C23C 16/40 (2013.01); C23C 16/403 (2013.01); C23C 16/45525 (2013.01); H10B 12/00 (2023.02); H10B 53/00 (2023.02); C01P 2006/40 (2013.01);
Abstract

A thin film structure including a dielectric material layer, a method of manufacturing the same, and an electronic device employing the same are disclosed. The disclosed thin film structure includes a first conductive layer; a first dielectric material layer on the first conductive layer, the first dielectric material layer having a crystal phase and including a metal oxide; an InO-based seed material layer formed on the first dielectric material layer and having a thickness less than a thickness of the first dielectric material layer; and a second conductive layer formed on the seed material layer.


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