The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Mar. 30, 2020
Applicant:
Fei Company, Hillsboro, OR (US);
Inventor:
Jakub Drahotsky, Brno, CZ;
Assignee:
FEI Company, Hillsboro, OR (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01L 7/00 (2006.01); G01N 1/28 (2006.01); G01N 1/42 (2006.01); H01J 37/20 (2006.01); H01J 37/26 (2006.01); G01N 23/203 (2006.01); G01N 23/225 (2018.01);
U.S. Cl.
CPC ...
B01L 7/50 (2013.01); G01N 1/2813 (2013.01); G01N 1/42 (2013.01); H01J 37/20 (2013.01); H01J 37/26 (2013.01); G01K 2203/00 (2013.01); G01N 23/203 (2013.01); G01N 23/225 (2013.01); G01N 2223/053 (2013.01); G01N 2223/071 (2013.01); G01N 2223/102 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/2065 (2013.01); H01J 2237/24585 (2013.01);
Abstract
Temperatures of cryo-electron microscopy samples are assessed based on images portions associated with high temperature superconductor (HTSC) areas or other thermal sensor materials that are thermally coupled to or thermally proximate the samples. Such thermal areas can be provided on sample mounts such as metallic grids, carbon films, or on sample stages. In examples using HTSCs, HTSCs having critical temperatures between −175° C. and −135° C. are typically used.